Does the hot wire plating process affect the coating thickness?

1. Adhesion
In the hot plating wire process, when the wire is sprayed or hot plated, it is necessary to ensure sufficient contact with the substrate surface, so that the wire is attached to the substrate surface. If the adhesion is insufficient, it will affect the uniformity and thickness of the coating. In order to ensure adequate contact between the wire and the substrate surface, it is necessary to pay attention to controlling parameters such as temperature, pressure and speed of spraying or hot plating.
2, substrate surface treatment
In the hot plating wire process, the surface treatment of the substrate is also very important, if there is dirt, grease or oxide on the surface of the substrate, it will affect the adhesion between the metal wire and the surface of the substrate, thus affecting the thickness of the coating. Therefore, before the hot plating process, the substrate surface needs to be treated, including the removal of grease and dirt, and degreasing, purification and activation treatment.

Galvanized to wire

3. Wire diameter and layout
The diameter and layout of the wire in the hot plating process will also affect the thickness of the coating. In general, the finer the diameter of the wire, the smaller the small particles that can be sprayed, which will affect the thickness of the coating. In addition, in the layout of the wire, it should be ensured that the coverage of the wire is uniform, and in the area with high coverage, the thickness of the coating will also increase accordingly.
4, bath temperature and concentration
In the hot wire plating process, the temperature and concentration of the plating solution will also affect the thickness of the coating. In general, the higher the temperature of the bath, the smaller the wire particles that can be sprayed, which will affect the thickness of the coating. In terms of bath concentration, too high or too low will affect the thickness of the coating. Therefore, in the hot plating process, the temperature and concentration of the plating solution need to be reasonably regulated.


Post time: 22-07-24